49.8 Deep Sleep Current Consumption DC Electrical Specifications

Table 49-9. Deep Sleep Current Consumption DC Electrical Specifications
DC Characteristics			Standard Operating Conditions: VDD33 = VDDIO = AVDD = 1.9–3.6V (Unless Otherwise Stated) Operating Temperature: -40°C ≤ T_A ≤ +85°C for Industrial Temperature -40°C ≤ TA ≤ +125°C for Extended Temperature
Parameter Number	Symbol	Characteristics	VDD/VDDIO	Typ.	Max.	Units	Conditions
BPWR_1	IDD_DS ^{(1, 2)}	MCU IDD in Deep Sleep mode powered from VDD	3.3V	1.44	—	µA	16 MHz XTAL = OFF SOSC = OFF RTC = ON LP_CLK = LPRC DSWDT = OFF FlexRAM is completely powered OFF (WCMSIZ.SRAM1_SIZ[1:0] = 0x0)
BPWR_3			1.9V	1.21	—	µA
BPWR_5			3.3V	2.32	—	µA	16 MHz XTAL = OFF SOSC = OFF RTC = ON LP_CLK = LPRC DSWDT = OFF 16 KB FlexRAM retention (WCMSIZ.SRAM1_SIZ[1:0] = 0x1)
BPWR_7			1.9V	2.05	—	µA
Note: Conditions: All Peripherals disabled with PMD bits. Disable the JTAG port. RF system OFF. CMCC is disabled. CPU is OFF. PreFetch cache is enabled. All GPIOs are set as input and pulled up. All PB clocks are set OFF. DSU is disconnected. RF system set in power down configuration. Deep Sleep Entry configured and WFI instruction executed: On exit by RTC interrupt, verify the RCON status to ensure the system is in Deep Sleep mode.

Figure 49-13. Deep Sleep Current RAM OFF