For the best PCB antenna performance, the PIC32WM-BZ6 Module must be placed at the edge of the host
board.
A low-impedance ground plane for the PIC32WM-BZ6 Module ensures the best radio performance (best range and lowest noise). The ground plane can be extended beyond the minimum recommendation as required for the host board EMC and noise reduction.
Exposed GND pads on the bottom of the PIC32WM-BZ6 Module must be soldered to the host board (see Example of Host Board on Top Layer figure in the PIC32WM-BZ6 Module Routing Guidelines from Related Links).
A PCB cutout or a copper keepout is required under RF test point. See PIC32WM-BZ6 Module Packaging Information from Related Links.
Copper keepout areas are required on the top layer under voltage test points. See PIC32WM-BZ6 Module Packaging Information from Related Links.
On the other hand, the entire region except the exposed ground paddle can be solder-masked.
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.
