39.3 Soldering Profile

The following table provides the recommended soldering profile from J-STD-20.

Table 39-1. Recommended Soldering Profile
Profile FeatureGreen Package
Average Ramp-up Rate (217°C to Peak)3°C/s max.
Preheat Temperature: 175°C ±25°C150-200°C
Time Maintained Above 217°C60-150s
Time Within 5°C of Actual Peak Temperature30s
Peak Temperature Range260°C
Ramp-Down Rate6°C/s max.
Time From 25°C to Peak Temperature8 minutes max.

A maximum of three reflow passes is allowed per component.