11 Revision History
Revision C (November 2023)
Removed 8-pad XDFN product offering.
Revision B (December 2020)
Updated UDFN package drawing. Removed WLCSP product offering. Replaced terminology "Master" and "Slave" with "Host" and "Client" respectively.
Revision A (November 2018)
Updated to the Microchip template. Microchip DS20006110 replaces Atmel document 8734. Corrected tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns. Deleted the AT24C128C-MAHMML-T and AT24C128C-UUMML-T package options. Updated Part Marking Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Added a figure for “System Configuration Using Two-Wire Serial EEPROMs”. Added POR recommendations section. Updated the SOIC, TSSOP and UDFN package drawings to Microchip format.
Atmel Document 8734 Revision D (August 2015)
Added the AT24C128C-MAHMML-T and AT24C128C-UUMML-T package options. Updated the 8S1 package outline drawing. Corrected reference of the 8U-9 to reflect the 4U-9 package option.
Atmel Document 8734 Revision C (January 2015)
Added the UDFN Expanded Quantity Option and the WLCSP package option. Updated the 8MA2 package outline drawing and the ordering information section.
Atmel Document 8734 Revision B (September 2012)
Updated UDFN package drawing and template and Atmel logo.
Atmel Document 8734 Revision A (April 2011)
Initial document release.