Maximum current rating requires even
load distribution across I/O pins. Maximum current rating may be limited by the
device package power dissipation characterizations. See the Thermal
Characteristics section to calculate device specifications.
Power dissipation is calculated
as follows:
PDIS = VDD x {IDD - Σ IOH} +
Σ {(VDD - VOH) x IOH} + Σ
(VOI x IOL)
Internal Power Dissipation is
calculated as follows:
PINTERNAL = IDD x VDD
where IDD is current to run the chip alone without
driving any load on the output pins.
I/O Power Dissipation is
calculated as follows:
PI/O =
Σ(IOL*VOL)+Σ(IOH*(VDD-VOH))
Derated Power is calculated as
follows:
PDER =
PDMAX(TJ-TA)/θJA
where TA = Ambient Temperature, TJ =
Junction Temperature.
: Stresses above those
listed under the “Absolute Maximum Ratings” section may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those
or any other conditions above those indicated in the operation listings of this
specification is not implied. Exposure above maximum rating conditions for extended
periods may affect device reliability.
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