9.1 SAM9X75 System-in-Package (SiP)

The Microchip SAM9X75 System-On-Module Series embeds the SAM9X75 SiP, which integrates the ARM926EJ-S Arm Thumb processor-based SAM9X75 MPU with an up to 2-Gbit DDR SDRAM (depending on the configuration) in a single package.

By combining the SAM9X75 with a DDR SDRAM memory in a single package, PCB routing complexity, area and number of layers are reduced. This makes board design easier and more robust by facilitating design for EMI, ESD and signal integrity.

For more information, refer to the SAM9X75 SiP data sheet (see Reference Documents).

The SAM9X75 SiP is available in a 16x16 mm 243-ball TFBGA package.

The Microchip SAM9X75 System-On-Module Series provides global system Reset (NRST) and Shutdown (SHDN) pins to the application board.

Note:
  • The NRST pin is an input/output pin generated by the internal power management unit (MCP16502) respecting the microprocessor power sequence timing. It is distributed internally to the microprocessor and can be forced externally for system level control.
  • The SHDN pin is an output pin managed by the application software. In an application case, the pin can switch on/off the 5V_MAIN external main supply.