13.1 SAM9X75 SOM Series Dimensions
| Parameter | Symbol | Common Dimensions | Comments | |||
|---|---|---|---|---|---|---|
| Min | Typ | Max | ||||
| Body overall dimensions | X | E | 34.850 | 35.000 | 35.150 | |
| Y | D | 29.850 | 30.000 | 30.150 | ||
| Pad pitch | e | – | 0.650 | – | ||
| PCB thickness | S | 1.440 | 1.600 | 1.760 | ||
| SOM total thickness | A1 | – | 2.800 | 2.850 | ||
| Pad length | Top side | P1t | – | 0.550 | – | |
| Bottom side | P1b | – | 0.900 | – | ||
| Pad width | P1 | – | 0.450 | – | ||
| Pad gap | aaa | – | 0.200 | – | ||
| Opening drill diameter | fff | – | 0.300 | – | ||
| Pad count | n | – | 174 | – | ||
| Test point diameter(1) | jjj | – | 1.000 | – | ||
| Test point count | m | – | 5 | – | ||
| Pad edge to SOM edge | X | P2a | – | 1.450 | – | |
| Y | P2b | – | 1.200 | – | ||
| Locating hole diameter(2) | LHd | 1.150 | 1.200 | 1.250 | ||
Note:
- Test points placed under the Microchip SAM9X75 System-On-Module Series are for production purposes only. Avoid any contact with the main board vias or copper areas (see Figure 13-1).
- Locating holes are used for production purposes.