59.2.2 Junction Temperature

Table 59-2. Thermal Operation Conditions
RatingSymbolMin.Typ.Max.Unit
Industrial Temperature Devices
Operating Ambient Temperature RangeTA -40 —85 °C
Operating Junction Temperature RangeTJ——105°C
V-temp Temperature Devices
Operating Ambient Temperature Range TA-40 —105 °C
Operating Junction Temperature Range TJ——125°C
Extended Temperature Range
Operating Ambient Temperature RangeTA -40 —125°C
Operating Junction Temperature RangeTJ——145°C
Power Dissipation:
Internal Chip Power Dissipation:

PINT = VDD x (IDD –∑ IOH)

I/O Pin Power Dissipation:

PI/O = ∑ (({VDD – VOH} x IOH) + ∑ (VOL x IOL))

PDPINT + PI/OW
Maximum Allowed Power DissipationPDMAX(TJ – TA)/θJAW
Note:
  1. θJA = Package thermal resistance, Junction-to-ambient (°C/W), see Thermal Resistance Data.
  2. When heatsink is used, PDMAX = (TJ-TA)/(θHEATSINK+θJC). Here θHEATSINK = Thermal resistance (°C/W) specification of the external cooling device. θJC= Package thermal resistance, Junction-to-case thermal resistance (°C/W). See Table Thermal Resistance Data for additional information.