Board-Specific Junction-to-Air Thermal Resistance

Junction-to-air thermal resistance is a critical parameter of any thermal system, and as such it needs to be evaluated in real conditions. The application board thermal resistance can be significantly different from the Microchip SAMA7G54-EK evaluation board resistance or from JEDEC-specified conditions. Depending on various parameters (PCB material and geometry, number of layers, etc.), that value may vary from 20°C/W to 40°C/W.