11 Revision History

Revision B (January 2025)

Updated the following sections: Features and Standby Mode. Removed “Typical” column from DC Characteristic table. Corrected Package Marking Information. Corrected and updated PIS section. Replaced terminology “Master” and “Slave” with “Host” and“Client”, respectively.

Revision A (January 2019)

Updated to the Microchip template. Microchip DS20006131 replaces Atmel document 8799. Updated Part Marking Information. Updated the "Software Reset" section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Added a figure for “System Configuration Using Two‑Wire Serial EEPROMs”. Updated "Block Diagram" figure. Updated POR recommendations section. Updated section content throughout for clarification. Removed the Automotive Grade 2 option. Removed GV variant TSSOP and UDFN options. Added the SOT23 package option and package drawing. Updated the SOIC, TSSOP and UDFN package drawings to Microchip format.

Atmel Document 8799 Revision C (September 2016)

Added the Automotive Grade 2 and 3 and UDFN options and table of contents. Updated 8S1 and 8X package drawings, footers, and reorganized the document.

Atmel Document 8799 Revision B (August 2012)

Removed preliminary status. Updated Atmel logos and disclaimer/copy page.

Atmel Document 8799 Revision A (March 2012)

Initial document release.