35.2.2 64-Pin VQFN for Industrial Variants
Note: The exposed die attach pad is not
connected electrically inside the device.
| 200 | mg |
| Package Outline Drawing MCHP reference | C04-21441 |
| JESD97 Classification | E3 |
| 200 | mg |
| Package Outline Drawing MCHP reference | C04-21441 |
| JESD97 Classification | E3 |
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