35.1.1 Thermal Resistance Data

The following table summarizes the thermal resistance data for non-AEC-Q100 packages..

Table 35-1. Thermal Resistance Data for non-AEC-Q100 packages
Package Type	θ_JA	θ_JC
32-pin TQFP	68.0°C/W	25.8°C/W
48-pin TQFP	78.8°C/W	12.3°C/W
64-pin TQFP	66.7°C/W	11.9°C/W
32-pin VQFN	37.2°C/W	13.1°C/W
48-pin VQFN	33.0°C/W	11.4°C/W
64-pin VQFN	33.5°C/W	11.2°C/W
64-ball UFBGA	67.4°C/W	12.4°C/W
45-ball WLCSP	37.0°C/W	0.36°C/W
27-ball WLCSP	84.54°C/W	16.86°C/W

The following table summarizes the thermal resistance data for AEC-Q100 packages.

Table 35-2. Thermal Resistance Data for AEC-Q100 packages
Package Type	θ_JA	θ_JC
64-pin TQFP	53.7	15.4
48-pin TQFP	58.6	16.1
32-pin TQFP	58.2	18.8
64-pin VQFN	28.4	12
48-pin VQFN	27.6	12.7
32-pin VQFN	29.8	15.9

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.