11.2.2 256-Ball TFBGA Mechanical Characteristics

Table 11-73. 256-ball TFBGA Package Characteristics
Moisture sensitivity levelMSL3
Table 11-74. Device and 256-ball TFBGA Package Weight
182mg
Table 11-75. 256-ball TFBGA Package Reference
JEDEC drawing referenceN/A
J-STD-609 classificatione8
Table 11-76. 256-ball TFBGA Package Information
Ball land0.400 mm
Nominal ball diameter0.320 mm
Solder mask opening0.275 mm
Solder mask definitionSolder Mask Defined (SMD)
SolderLF35