11 Revision History

Revision C (December 2024)

Replaced old Atmel 8U3-1 package drawing with Microchip E8B package drawing C04-21198. No change to form, fit or function. Updated Date Codes table format.

Revision B (March 2021)

Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively. Updated formatting to current template. Updated the PDIP, SOIC, TSSOP, UDFN and SOT23 package drawings to Microchip format. Removed WLCSP product offering.

Revision A (October 2017)

Updated to the Microchip template. Microchip DS20005858 replaces Atmel document 8906. Updated the "Software Reset" section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings.

Atmel Documentation 8906 Revision F (January 2017)

Updated Power-on Requirements and Reset Behavior section.

Atmel Documentation 8906 Revision E (December 2016)

Part marking SOT23: Moved backside mark (YMXX) to front side line 2. Added @ = Country of Assembly.

Atmel Document 8906 Revision D (November 2015)

Added, "Since the WLCSP has no WP pin, the write protection feature is not offered on the WLCSP." Updated the 8MA2 - UDFN and 4U-5 - WLCSP package drawings.

Atmel Document 8906 Revision C (May 2015)

Updated 8S1 - JEDEC SOIC and 4U-5 - WLCSP package drawings.

Atmel Document 8906 Revision B (January 2015)

Added 100 kHz timing set for reference, UDFN extended quantity option, and the figure for "System Configuration Using 2-Wire Serial EEPROMs." Updated the 8X, 8MA2, and 4U-5 package outline drawings and the ordering information section. Remove preliminary status.

Atmel Document 8906 Revision A (April 2014)

Initial release of this document.