45.1 Absolute Maximum Ratings(†)

Parameter Rating
Ambient temperature under bias -40°C to +125°C
Storage temperature -65°C to +150°C
Voltage on pins with respect to VSS
  • on VDD pin:
 -0.3V to +6.5V
  • on VDDIO2 pin:
 with I3C Disabled -0.3V to +6.5V
with I3C Enabled -0.3V to +3.63V
  • on VDDIO3 pin:
 with I3C Disabled -0.3V to +6.5V
with I3C Enabled -0.3V to +3.63V
  • on MCLR pin:
 -0.3V to +9.0V
  • on pins on VDD domain:
 -0.3V to (VDD + 0.3V)
  • on pins on VDDIO2 domain:
 -0.3V to +6.5V
  • on pins on VDDIO3 domain:
 -0.3V to +6.5V
Maximum current(1)
  • on VSS pin
 -40°C ≤ TA ≤ +85°C 140 mA
85°C < TA ≤ +125°C 60 mA
  • on VDD pin (14-pin devices)
 -40°C ≤ TA ≤ +85°C 140 mA
85°C < TA ≤ +125°C 50 mA
  • on VDD pin (20-pin devices)
 -40°C ≤ TA ≤ +85°C 190 mA
85°C < TA ≤ +125°C 65 mA
  • on VDDIO2 pin
 -40°C ≤ TA ≤ +85°C 190 mA
85°C < TA ≤ +125°C 65 mA
  • on VDDIO3 pin
 -40°C ≤ TA ≤ +85°C 190 mA
85°C < TA ≤ +125°C 65 mA
  • on pins on the VDD domain
 ±50 mA
  • on pins on the VDDIO2 domain
 ±50 mA
  • on pins on the VDDIO3 domain
 ±50 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD) ±20 mA
Total power dissipation(2) 800 mW
Note:
  1. Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations. See the Thermal Characteristics section to calculate device specifications.
  2. Power dissipation is calculated as follows:

    PDIS = VDD x {IDD - Σ IOH} + Σ {(VDD - VOH) x IOH} + Σ (VOI x IOL).

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.