3.2.1 Ordering Information

A clarification has been made to the table Package Type for all devices with 100C1 package.

Ordering CodeFlash (bytes)EEPROM (bytes)SRAM (bytes)Speed (MHz)Power SupplyPackage (1)(2)(3)Temp.
ATxmega128A1U-AU128K + 8K2K8K321.6 - 3.6V100A-40°C - 85°C
ATxmega128A1U-AUR(4)128K + 8K2K8K
ATxmega64A1U-AU64K + 4K2K4K
ATxmega64A1U-AUR(4)64K + 4K2K4K
ATxmega128A1U-CU128K + 8K2K8K100C1(5)
ATxmega128A1U-CUR(4)128K + 8K2K8K
ATxmega64A1U-CU64K + 4K2K4K
ATxmega64A1U-CUR(4)64K + 4K2K4K
ATxmega128A1U-C7U128K + 8K2K8K100C2
ATxmega128A1U-C7UR(4)128K + 8K2K8K
ATxmega64A1U-C7U64K + 4K2K4K
ATxmega64A1U-C7UR(4)64K + 4K2K4K
ATxmega128A1U-AN128K + 8K2K8K321.6 - 3.6V100A-40°C - 105°C
ATxmega128A1U-ANR(4)128K + 8K2K8K
ATxmega128A1U-CN128K + 8K2K8K100C1(5)
ATxmega128A1U-CNR(4)128K + 8K2K8K
Note:
  1. This device can also be supplied in wafer form. Contact your local Microchip sales office for detailed ordering information.
  2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
  3. For packaging information, see “Packaging information”.
  4. Tape and Reel.
  5. This package is no longer available.
Package Type
100A100-lead, 14 x 14 x 1.0 mm, 0.50 mm lead pitch, thin profile plastic quad flat package (TQFP)
100C1100-ball, Thin Fine Pitch Ball Grid Array (B2B) - 9 x 9 x 1.2 mm Body (TFBGA)
100C2100-ball, 7 x 7 x 1.0 mm body, ball pitch 0.65 mm, very thin fine-pitch ball grid array (VFBGA)