3.2.1 Ordering Information

A clarification has been made to the table Package Type for all devices with 100C1 package.

Ordering Code Flash (bytes) EEPROM (bytes) SRAM (bytes) Speed (MHz) Power Supply Package (1)(2)(3) Temp.
ATxmega128A1U-AU 128K + 8K 2K 8K 32 1.6 - 3.6V 100A -40°C - 85°C
ATxmega128A1U-AUR(4) 128K + 8K 2K 8K
ATxmega64A1U-AU 64K + 4K 2K 4K
ATxmega64A1U-AUR(4) 64K + 4K 2K 4K
ATxmega128A1U-CU 128K + 8K 2K 8K 100C1(5)
ATxmega128A1U-CUR(4) 128K + 8K 2K 8K
ATxmega64A1U-CU 64K + 4K 2K 4K
ATxmega64A1U-CUR(4) 64K + 4K 2K 4K
ATxmega128A1U-C7U 128K + 8K 2K 8K 100C2
ATxmega128A1U-C7UR(4) 128K + 8K 2K 8K
ATxmega64A1U-C7U 64K + 4K 2K 4K
ATxmega64A1U-C7UR(4) 64K + 4K 2K 4K
ATxmega128A1U-AN 128K + 8K 2K 8K 32 1.6 - 3.6V 100A -40°C - 105°C
ATxmega128A1U-ANR(4) 128K + 8K 2K 8K
ATxmega128A1U-CN 128K + 8K 2K 8K 100C1(5)
ATxmega128A1U-CNR(4) 128K + 8K 2K 8K
Note:
  1. This device can also be supplied in wafer form. Contact your local Microchip sales office for detailed ordering information.
  2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
  3. For packaging information, see “Packaging information”.
  4. Tape and Reel.
  5. This package is no longer available.
Package Type
100A 100-lead, 14 x 14 x 1.0 mm, 0.50 mm lead pitch, thin profile plastic quad flat package (TQFP)
100C1 100-ball, Thin Fine Pitch Ball Grid Array (B2B) - 9 x 9 x 1.2 mm Body (TFBGA)
100C2 100-ball, 7 x 7 x 1.0 mm body, ball pitch 0.65 mm, very thin fine-pitch ball grid array (VFBGA)