Introduction

Microchip’s SmartFusion®2 Advanced Development Kit has a full featured 150K LE SmartFusion2 system-on-chip (SoC) FPGA. This 150K LE device inherently integrates reliable flash-based FPGA fabric, a 166 MHz Arm® Cortex®-M3 processor, digital signal processing (DSP) blocks, static random-access memory (SRAM), embedded nonvolatile memory (eNVM), and industry-required high-performance communication interfaces all on a single chip. It also supports all the data security features that are available in the SmartFusion2 devices.

The Advanced Development Kit board has numerous standard and advanced peripherals, such as PCIe®x4 edge connector, two FPGA mezzanine card (FMC) connectors for using many off-the-shelf daughter cards, USB, Philips inter-integrated circuit (I²C), two gigabit Ethernet ports, serial peripheral interface (SPI), and UART. A high-precision operational amplifier circuitry on the board helps to measure core power consumption by the device.

The SmartFusion2 Advanced Development Kit includes 1 Gb of on-board double data rate3 (DDR3) memory and 2 Gb SPI flash—1 Gb connected to the Microcontroller Subsystem (MSS) and 1 Gb connected to the FPGA fabric. The serializer and deserializer (SerDes) blocks can be accessed through the PCIe edge connector, high-speed sub-miniature push-on (SMA) connectors, or through onboard FMC connector.