32.1 Absolute Maximum Ratings^(†)


Parameter		Rating
Ambient temperature under bias		-40°C to +125°C
Storage temperature		-65°C to +150°C
Voltage on pins with respect to V_SS
on V_DD pin:		-0.3V to +6.5V
on MCLR pin:		-0.3V to +9.0V
on all other pins:		-0.3V to (V_DD + 0.3V)
Maximum current
on V_SS pin⁽¹⁾	-40°C ≤ T_A ≤ +85°C	300 mA
on V_SS pin⁽¹⁾	85°C < T_A ≤ +125°C	120 mA
on V_DD pin⁽¹⁾	-40°C ≤ T_A ≤ +85°C	250 mA
on V_DD pin⁽¹⁾	85°C < T_A ≤ +125°C	85 mA
on any standard I/O pin		±25 mA
Clamp current, I_K (V_PIN < 0 or V_PIN > V_DD)		±20 mA
Total power dissipation⁽²⁾		800 mW

Note:

Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be limited by the device package power dissipation characterizations, see “Thermal Characteristics” to calculate device specifications.
Power dissipation is calculated as follows:
P_DIS = V_DD x {I_DD - Σ I_OH} + Σ {(V_DD - V_OH) x I_OH} + Σ (V_OI x I_OL)
Internal Power Dissipation is calculated as follows:
P_INTERNAL = I_DD x V_DD
where I_DD is current to run the chip alone without driving any load on the output pins.
I/O Power Dissipation is calculated as follows:
P_I/O =Σ(I_OL*V_OL)+Σ(I_OH*(V_DD-V_OH))
Derated Power is calculated as follows:
P_DER = PD_MAX(T_J-T_A)/θ_JA
where T_A=Ambient Temperature, T_J = Junction Temperature.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods may affect device reliability.

32.1 Absolute Maximum Ratings(†)

32.1 Absolute Maximum Ratings^(†)