1 SAM9x5 vs. SAM9X60 Feature Summary
The following table summarizes the differences between SAM9x5 and SAM9X60 features.
Item | SAM9x5 | SAM9X60 | Comments |
---|---|---|---|
System | |||
Core/Bus frequency | 400/133 MHz | 600/200 MHz | – |
L1 cache size | 16 Kbytes I + 16 Kbytes D | 32 Kbytes I + 32 Kbytes D | – |
SRAM size | 32 Kbytes | 64 Kbytes + 4 Kbytes for OTP emulation | – |
OTP memory | – |
| 23 Kbytes allocated to user |
ROM boot | No security/encryption features | Secure boot with encryption, certificates and key management (see OTP) | – |
Power supplies | 1.0V core voltage |
| For PLLs and oscillators |
System controller, clocks, power management |
|
|
Safety for WDT, RSTC, etc. EMI/EMC improvement |
DMA | 2x 8-channel DMAs | 1x 16-channel DMA | – |
DDR controller | External resistors needed for PCB impedance matching | DDR I/Os with calibration for impedance matching, additional control signal | Reduced BOM cost and board space |
NAND Flash | 16-bit | 8-bit only | – |
Special Function Register | Memory mapped in Matrix section | Memory mapped in SFR section | – |
Peripheral Multiplexing on I/O lines | – |
Compatible 7 lines added Peripherals added | – |
Peripheral Upgrades | |||
eMMC | HSMCI, eMMC 4.1 | SDMMC, eMMC 4.51 | |
Serial |
USART0-2 SPI0-1 TWI0-2 UART0-1 |
FLEXCOM0-2 FLEXCOM4-5(*) FLEXCOM6-8 FLEXCOM9-10 FLEXCOM3-11-12 added (*)Some FLEXCOMs include extra IOSETs. | Some FLEXCOMs enable USART, SPI and TWI functions, or only UART and TWI |
USB |
2x HS + 1x FS transceivers 4-Kbyte DPRAM with dynamic allocation |
3x HS transceivers External Full Speed resistors removed 16-Kbyte DPRAM; each end point has its own memory area | – |
Soft Modem (SMD) | Embedded | Removed | – |
LCD controller |
4 layers:
800x600 pixel resolution |
4 layers:
1024x768 pixel resolution | – |
2D graphics (GFX2D) | – | Added | – |
ADC |
10 bits |
12 bits Internal triggers | – |
64-bit Timer (PIT64B) | – | Added | – |
QSPI | – | 4-bit QSPI added with dedicated power supply | SDR and DDR support; eXecution In Place (XIP) |
I2SMCC | – | Added | – |
CLASSD | – | Added | – |
Encryption engines (TDES, AES, SHA, TRNG) | – | Added | – |
Packages |
BGA217, 15x15 mm2, 0.8 mm pitch BGA247, 10x10 mm2, 0.5 mm pitch |
BGA196 11x11 mm2 0.65 mm pitch for SiP with 64-Mbit SDRAM BGA228, 11x11 mm2, 0.65 mm pitch BGA233 14x14 mm2 0.8 mm pitch for SiP with 512-Mbit and 1-Gbit DDR2 SDR-SDRAM and DDR2-SDRAM SiP added |
Accommodates 4-layer PCBs |