2 High Level Application Design

The main project includes a combination of two layers: The software layer and the hardware layer. The software layer is divided into two other parts:

The MPLAB® Code Configurator (MCC) generated code (CMP, TMR, OPA)
The main application code

The following diagram represents the connection between the software and hardware parts used to develop the application.

Figure 2-1. High-Level Design of Software Application

The following picture shows a PROTO Click board that includes both the LC and RC circuits. This PROTO Click is used in the first slot of mikroBUS place to overlap with the set pins:

Figure 2-2. Metal Detector - Prototype