1.1.1 2-Lead VSFN Contact Package

The 2-Lead VSFN contact package is a unique package that is especially suited for disposable and accessory applications where a cartridge or accessory is replaced on a regular basis. Typical integrated circuit packages require the package to be soldered down to a PCB. Most often this board has multiple ICs and/or passive devices.

For disposable applications where the only reason to add electronics is to authenticate the disposable, the requirement is often reduced to a single cryptographic IC plus a decoupling capacitor. The SHA106 contains both the IC and the decoupling capacitor so all electronics needed by the disposable are entirely contained in the packaged device. An alternative method to connect to the package, then, can eliminate the need for a PCB in the system.

Contact packages provide a unique solution where, instead of soldering the pads of the device down to a PCB board, the package is, instead, attached to the accessory by gluing the top side of the package to the accessory. The pads of the package are left exposed for future connection to the host system. Typically, some sort of a 2-pin contactor or pogo pin connections are used to connect the accessory device to the host system. This approach allows for a simple and reliable connection between the disposable and the host device, while minimizing the cost to add authentication to the accessory.