2 Pin Descriptions
The descriptions of the pins are listed in Table 2-1.
| Name | 8‑Lead SOIC | 8‑Lead SOIJ | 8‑Lead TSSOP | 8‑Pad UDFN(1) | 8‑Ball VFBGA | 8-Ball WLCSP | Function |
|---|---|---|---|---|---|---|---|
| A0(2) | 1 | 1 | 1 | 1 | 1 | A5 | Device Address Input |
| A1(2) | 2 | 2 | 2 | 2 | 2 | B4 | Device Address Input |
| A2(2) | 3 | 3 | 3 | 3 | 3 | C3 | Device Address Input |
| GND | 4 | 4 | 4 | 4 | 4 | C5 | Ground |
| SDA | 5 | 5 | 5 | 5 | 5 | C1 | Serial Data |
| SCL | 6 | 6 | 6 | 6 | 6 | B2 | Serial Clock |
| WP(2) | 7 | 7 | 7 | 7 | 7 | A3 | Write-Protect |
| VCC | 8 | 8 | 8 | 8 | 8 | A1 | Device Power Supply |
Note:
- The exposed pad on this package can be connected to GND or left floating.
- If the A0, A1, A2 or WP pins are not driven, they are internally pulled down to GND. In order to operate in a wide variety of application environments, the pull‑down mechanism is intentionally designed to be somewhat strong. Once these pins are biased above the CMOS input buffer’s trip point (~0.5 x VCC), the pull‑down mechanism disengages. Microchip recommends connecting these pins to a known state whenever possible.