11.2.1 343-Ball TFBGA Mechanical Characteristics

Table 11-82. 343-Ball TFBGA Package Characteristics
Moisture Sensitivity LevelMSL3
Table 11-83. Device and 343-Ball TFBGA Package Weight
410mg
Table 11-84. Package Reference
JEDEC Drawing Referencee3
J-STD-609 Classificatione8
Table 11-85. 343-Ball TFBGA Package Information
Ball Land0.40 mm
Nominal Ball Diameter0.35 mm
Solder Mask Opening0.300 mm
Solder Mask DefinitionSMD
SolderSAC105