11.2.2 375-Ball TFBGA Mechanical Characteristics

Table 11-86. 375-Ball TFBGA Package Characteristics
Moisture Sensitivity LevelMSL3
Table 11-87. Device and 375-Ball TFBGA Package Weight
190mg
Table 11-88. Package Reference
J-STD-609 Classificatione8
Table 11-89. 375-Ball TFBGA Package Information
Ball Land0.350 mm
Nominal Ball Diameter0.250 mm
Solder Mask Opening0.250 mm
Solder Mask DefinitionSolder Mask Defined (SMD)
SolderLF35