37.9 Thermal Specifications
Symbol | Description | Typ. | Unit | Conditions |
---|---|---|---|---|
θJA | Thermal Resistance Junction to Ambient | 60 | °C/W | 28-pin PDIP package (SP) |
47 | °C/W | 28-pin SOIC package (SO) | ||
67.1 | °C/W | 28-pin SSOP package (SS) | ||
36.1 | °C/W | 32-pin VQFN package (RXB) | ||
58.8 | °C/W | 32-pin TQFP package (PT) | ||
33.7 | °C/W | 48-pin VQFN package (6LX) | ||
55.6 | °C/W | 48-pin TQFP package (PT) | ||
30.2 | °C/W | 64-pin VQFN package (MR) | ||
38.7 | °C/W | 64-pin TQFP package (PT) | ||
TJMAX | Maximum Junction Temperature | 150 | °C | |
Note:
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