3 Carrier Board Stencil Design

It is recommended to use a laser-cut, stainless-steel type with thickness equal or higher than 150 μm, and a ratio of -3% for stencil opening to land pattern dimension.

To improve paste release, a positive taper with a bottom opening 25 μm larger than the top is used. If necessary, the manufacturer may propose other combinations of stencil thickness and aperture size to obtain good results, for example, a multi-level stepped stencil.