2 Bake Information

Microchip SOMs are rated MSL3; storage and assembly processes must comply with IPC/JEDEC J-STD-033C.

The SOMs have a total thickness comprised between 2.45 and 3.50 mm (PCB and SMD mounted) and are comparable to a die package. Thus, baking instructions must comply with Table 4-1 of J-STD-033C as a package body comprised between 2.0 mm and 4.5 mm. See the summary table below.

Table 2-1. IPC/JEDEC Table Extract
Package Body	MSL Level	Bake @ 125°C		Bake @ 90°C ≤ 5% RH		Bake @ 40°C ≤ 5% RH
Package Body	MSL Level	Exceeding Floor Life by > 72h	Exceeding Floor Life by ≤ 72h	Exceeding Floor Life by > 72h	Exceeding Floor Life by ≤ 72h	Exceeding Floor Life by > 72h	Exceeding Floor Life by ≤ 72h
Thickness > 2.0 mm ≤ 4.5 mm	3	48 hours	48 hours	10 days	8 days	79 days	67 days

Note: It is recommended to bake the carrier board PCB before the assembly process and store it in a dry cabinet to prevent moisture regain and delamination.