10.1.3 Recommended Operating Conditions

Table 10-3. Recommended Operating Conditions on Power Supply Inputs
Power Input	Parameter	Conditions	Min	Max	Unit
VDDCORE	Core logic power supply (including CPU, memories and peripherals)	f_CPU ≤ 420 MHz, f_MCK ≤ 140 MHz f_CPU ≤ 600 MHz, f_MCK ≤ 200 MHz	1.02 1.12	1.21 1.21	V
VDDIOM	SDRAM I/O lines power supply	SDR-SDRAM	3.00	3.60	V
VDDIOM	SDRAM I/O lines power supply	LPDDR-SDRAM, LPSDR-SDRAM, DDR2-SDRAM	1.70	1.90	V
VDDNF	NAND Flash I/O lines power supply	–	1.70	3.60	V
VDDQSPI	VDDQSPI I/O lines power supply	–	1.70	3.60	V
VDDANA⁽¹⁾	VDDANA I/O lines, A/D converter, OTP memory power supply	–	3.00	3.60	V
VDDIN33⁽¹⁾	2.5V regulator power input, USB interface I/O lines power supply	–	3.00	3.60	V
VDDIOP0	VDDIOP0 I/O lines power supply	–	1.70	3.60	V
VDDIOP1	VDDIOP1 I/O lines power supply	–	1.70	3.60	V
VDDBU	Backup domain power supply	–	1.60	3.60	V
t_{R_VDD}	Power supply slope at power-up	Applies to any of the power supply inputs listed above	0.2	20	mV/µs
t_{F_VDD}	Power supply slope at power-down	Applies to any of the power supply inputs listed above	-20	-1	mV/µs

Note:

VDDANA and VDDIN33 are powered from one single power source so that:
V(VDDANA,VDDIN33) ≤ ±50mV.

Table 10-4. Recommended Operating Conditions on Input Pins (see Note 1)
Symbol	Parameter	Conditions	Min	Max	Unit
V_IN	Input line voltage range on inputs⁽²⁾⁽³⁾	–	-0.3V	V_DD+ 0.3V	V
I_IN	DC current injection on inputs⁽⁴⁾	–	–	±0.2	mA
I_{TOT_INJ}	Total current injection per power rail or per ground rail⁽⁵⁾	–	–	±2	mA

Note:

In this table, VDD refers to the voltage of the associated power rail of the I/O line, as defined in the Pin Description table. For example, for PA2, VDD refers to VDDIOP0.
Input voltages V_IN≤ 0V or V_IN ≥ VDD lead to negative or positive current injection on inputs.
For analog inputs [PB17:PB6], input voltages V_IN ≥ min(V_DDANA, V_ADVREFP) lead to saturated A/D conversion to 0xFFF.
Current injection on A/D converter analog inputs [PB17:PB6] may degrade the analog performance of the corresponding channel or the analog performance of other analog channels.
Corresponds to the sum of the positive currents into one power rail and, respectively, to the sum of the negative currents into one ground rail, as defined in the Pin Description table.

Table 10-5. Recommended Thermal Operating Conditions
Symbol	Parameter	Conditions		Min	Max	Unit
T_A	Ambient temperature range	–		-40	105	°C
T_J	Junction temperature range	–		-40	125	°C

Table 10-6. BGA228 Package Thermal Characteristics
Symbol	Parameter	Conditions	Typ	Unit
R_JA	Junction-to-ambient thermal resistance	–	37	°C/W
R_JC	Junction-to-case thermal resistance	–	18	°C/W
R_JB	Junction-to-board thermal resistance	–	25	°C/W
Ψ_J-top	Junction-to-package-top characterization parameter	–	0.5	°C/W

Table 10-7. BGA256 Package Thermal Characteristics
Symbol	Parameter	Conditions	Typ	Unit
R_JA	Junction-to-ambient thermal resistance	–	41	°C/W
R_JC	Junction-to-case thermal resistance	–	20	°C/W
R_JB	Junction-to-board thermal resistance	–	29	°C/W
Ψ_J-top	Junction-to-package-top characterization parameter	–	0.6	°C/W

Table 10-8. Recommended Operating Conditions on Internal Clocks
Symbol	Parameter	Conditions	Min	Max	Unit
f_{CPU_CLK}	Processor clock (CPU_CLK) frequency	V_DDCORE ≥ 1.12V	–	600	MHz
f_{CPU_CLK}	Processor clock (CPU_CLK) frequency	V_DDCORE ≥ 1.02V	–	420	MHz
f_MCK	Main system bus clock (MCK) frequency	V_DDCORE ≥ 1.12V	–	200	MHz
f_MCK	Main system bus clock (MCK) frequency	V_DDCORE ≥ 1.02V	–	140	MHz

Table 10-9. Recommended Operating Conditions on SDRAM Interface
Symbol	Parameter	Conditions	Min	Max	Unit
f_{SDRAM_CLK}	SDRAM clock frequency	V_DDCORE ≥ 1.12V
		16-bit SDR-SDRAM	–	200	MHz
		16-bit LPSDR-SDRAM	–	166	MHz
		16-bit DDR2-SDRAM	125	200	MHz
		16-bit LPDDR-SDRAM	–	200	MHz
		V_DDCORE ≥ 1.12V
		32-bit SDR-SDRAM	–	180	MHz
		32-bit LPSDR-SDRAM	–	158	MHz
		V_DDCORE ≥ 1.02V
		16-bit SDR-SDRAM	–	140	MHz
		16-bit LPSDR-SDRAM	–	140	MHz
		16-bit DDR2-SDRAM	125	140	MHz
		16-bit LPDDR-SDRAM	–	140	MHz