10.2.2 256-Ball TFBGA Mechanical Characteristics

Table 10-72. 256-ball TFBGA Package Characteristics
Moisture sensitivity levelMSL3
Table 10-73. Device and 256-ball TFBGA Package Weight
182mg
Table 10-74. 256-ball TFBGA Package Reference
J-STD-609 classificatione8
Table 10-75. 256-ball TFBGA Package Information
Ball land0.400 mm
Nominal ball diameter0.320 mm
Solder mask opening0.275 mm
Solder mask definitionSolder Mask Defined (SMD)
SolderLF35