Features Overview

  • Single-Voltage Read and Write Operation:

    • 2.7V to 3.6V

  • Serial Interface Architecture:
    • Mode 0 and Mode 3
    • x1 (Single), x2 (Dual) and x4 (Quad) Serial Peripheral Interface (SPI) modes
    • x1 DTR, x2 DTR and x4 DTR
    • x4 (QPI)
    • x4 (QPI) DTR
    • 3-byte or 4-byte addresssing
  • High-Speed Clock Frequency:
    • 166 MHz
  • Burst Modes:
    • Continuous linear burst
    • 8/16/32/64-byte linear burst with wrap-around
  • Low-Power Consumption:
    • Active Read current: 10 mA (typical @ 166 MHz)
    • Deep Power-Down current: 0.5 μa (typical)
  • Uniform Erase Capability:
    • Uniform 4-KB sectors
    • Overlay uniform 32-KB blocks
    • Overlay uniform 64-KB blocks
  • Fast Erase Time:
    • Sector erase time: 40 ms (typical), 600 ms (maximum)
    • 32-KB block erase time: 0.1s (typical), 1.5s (maximum)
    • 64-KB block erase time: 0.15s (typical), 1.8s (maximum)
    • Chip erase time: 50s (typical), 400s (maximum)
  • Page Program:
    • 256 bytes per page
  • Page Program Time:
    • 0.25 ms (typical), 4 ms (maximum)
  • End-of-Write Detection:
    • Software polling via the Busy bit in the status register
  • Write Suspend:
    • Suspend Program or Erase operation to access another block/sector
  • Software Reset
  • Hardware Reset# Pin Available in SPI and SDI Mode
  • Software Protection
  • Three Status/Configuration Setting Registers
  • Group Block Protection
  • Configurable Dummy Cycles for Read Commands
  • Supports Adjustable Drive Strength

  • Supports ECC (Single-Bit Error Correction and Double-Bit Error Detection), including an /ECS output pin

  • Superior Reliability:
    • Endurance: 100,000 cycles (minimum)
    • Greater than 20 years data retention
  • Three 2048-Byte Security Registers
  • Temperature Range:
    • -40°C to +85°C (Industrial)
    • -40°C to +105°C (Industrial Plus)