44.3.6 Thermal Characteristics

Table 44-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	60.0	°C/W	28-pin SPDIP package
			80.0	°C/W	28-pin SOIC package
			90.0	°C/W	28-pin SSOP package
			27.5	°C/W	28-pin VQFN 4x4 mm package
			47.2	°C/W	40-pin PDIP package
			29.0	°C/W	40-pin VQFN 5x5 mm package
			46.0	°C/W	44-pin TQFP 10x10 mm package
TH02⁽¹⁾	T_JMAX	Maximum Junction Temperature	150	°C
Note: See the "Absolute Maximum Ratings" section for total power dissipation.

DS40002485C

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