Features

  • Specified Configuration Zone with limited selectable options.
  • I/O Options
    • I2C Interface with One-Time Changeable I2C Address
    • Single Wire Interface (SWI)
  • JIL High Rating – Validated to JIL Application of Attack Potential to Smartcards and Similar Devices, Version 3.1
  • Internal High-Quality NIST SP 800-90A/B/C True Random Number Generator (TRNG) NIST CMVP ESV Certified
  • One Permanent Primary P-256 Elliptic Curve Cryptography (ECC secp256r1) Private Key Fixed at Manufacturing Time
  • One Internal Sign Private Key for Key Attestation
  • Three Secondary P-256 ECC Private Keys that Can Be Regenerated by the User
  • Signer Public Key from Signer Certificate
  • Public Key Validation Support
  • One Customizable Symmetric Secret Key Slot
  • IO Protection Key Slot to Protect Interface Communication
  • Secure Boot Enabled with Customizable Secure Boot Public Key at Time of Manufacture
  • ECDH/KDF Key Slot Capable of Being Used with AES Keys and Commands
  • X.509 Compressed Certificate Storage
  • Customizable Certificate Storage Slots
  • 1.8V to 5.5V IO Levels, 2.0V to 5.5V Supply Voltage
  • Standard Industrial Temperature Range: -40℃ to +85℃
  • 30 nA nominal Sleep Current
  • Available in 8-Pad UDFN and 8-Pin SOIC package options at a 2k MOQ