11 Revision History

Revision A (April 2020)

Updated to Microchip template. Microchip DS20006342 replaces Atmel document 8859. Corrected t_LOW typo from 400 ns to 500 ns. Corrected t_AA typo from 550 ns to 450 ns. Updated Package Marking Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated formatting throughout for clarification. Added a figure for “System Configuration Using 2‑Wire Serial EEPROMs”. Updated “Block Diagram” figure. Added POR recommendations section. Updated formatting to current template. Updated the SOIC, TSSOP, UDFN and SOT23 package drawings to Microchip format.

Atmel Document 8859 Revision C (March 2017)

Corrected ISB2 spec to 6.0 µA.

Atmel Document 8859 Revision B (January 2015)

Added bulk SOIC and TSSOP, and UDFN Expanded Quantity options. Updated from preliminary to complete status, ordering code table, 8X and 8MA2 package drawings and the disclaimer page. Corrected pinouts from bottom to top view and reorganization figures. No changes to functional specification.

Atmel Document 8859 Revision A (February 2013)

Initial release of this document.