11 Revision History

Revision B (January 2021)

Replaced terminology "Master" and "Slave" with "Host" and "Client" respectively. Updated UDFN package drawing. Removed 5-ball WLCSP product offering.

Revision A (November 2018)

Updated to the Microchip template. Microchip DS20006109 replaces Atmel document 8905. Updated Part Marking Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Updated the PDIP, SOIC, TSSOP, SOT23 and UDFN package drawings to Microchip format.

Atmel Document 8905 revision H (January 2017)

Updated Power On Requirements and Reset Behavior section.

Atmel Document 8905 revision G (December 2016)

Atmel Document 8905 revision F (May 2016)

Corrected the device share from two to eight on a common 2-wire bus.

Atmel Document 8905 revision E (November 2015)

Added the AT24C32E-MAHMML-T and AT24C32E-U1UMML-T package options. Updated the 8MA2 package drawing.

Atmel Document 8905 revision D (June 2015)

Updated the part marking page.

Atmel Document 8905 revision C (May 2015)

Added the 4-ball WLCSP, AT24C32E-U1UM0B-T option and updated the package drawings.

Atmel Document 8905 revision B (January 2015)

Added the 100 kHz timing set for reference, the UDFN extended quantity option, and the figure for “System Configuration Using 2-Wire Serial EEPROMs”. Updated Software Reset section, and the 8X, 8MA2, and 8P3 package outline drawings. Replaced the 5U-4 with the 5U-2 package outline drawing.

Atmel Document 8905 revision A (May 2014)

Initial document release.