11 Revision History

Revision D (November 2025)

: No changes have been made to the functional operation or electrical characteristics of the device.

: No changes have been made to the functional operation or electrical characteristics of the device.

Features: Added AEC-Q100 bullet to Features list.
Random Number Generator (RNG): Updated SP 800-90C to the released version of the spec.
8-Lead SOIC: Updated SOIC package drawings to latest version.

: No changes have been made to the actual silicon. Changes are only to the data sheet.

Introduction: WPC updates to indicate support for Qi 2.x and Ki 1.x.
Features:
- Added NIST certified to TRNG bullet.
- Updated WPC bullet indicating support for Qi2.x and Ki 1.x standards.
- Added VDFN package option.
Use Cases: Added Ki use cases.
Pin Configuration and Pinouts: Updated for VDFN package.
Wireless Power Consortium: Updated for Qi 2.x and Ki 1.x.
Wireless Power Consortium Terminology: Added Ki term.
Random Number Generator (RNG): Added specification information. Added ESV information.
DC Parameters: All I/O Interfaces:
- Added input thresholds when in Sleep mode (V_ILS, V_IHS).
- Updated Theta J_A values. Added VDFN value.
GenKey Command: Removed MAC calculation from TFLX data sheet versions.
Nonce Command: Removed session key information.
Use Cases: Updated use case information to cover Qi and Ki.
WPC Engagement: Updated to cover Qi and Ki.
Hardware Tools: Added/updated tool descriptions.
Package Drawings: Added VDFN package information.
Product Identification System: Product Identification now separate section and not part of Back Matter. Updated ordering codes. Added VDFN package information.
Microchip Information: Back Matter simplified per Microchip’s new standard.