11 Revision History

Revision A (March 2020)

Updated to Microchip template. Microchip DS20006330 replaces Atmel document 8870. Corrected tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns. Updated Part Marking Information. Updated the "Software Reset" section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Added a figure for “System Configuration Using Two‑Wire Serial EEPROMs”. Updated "Block Diagram" figure. Added POR recommendations section. Updated formatting to current template. Updated the SOIC, TSSOP, SOT23 and UDFN package drawings to Microchip format.

Atmel Document 8870 Revision E (January 2015)

Add the UDFN Expanded Quantity Option and update the ordering information section. Update the 8MA2 package outline drawing.

Atmel Document 8870 Revision D (August 2014)

Add bulk SOIC and TSSOP ordering codes. Update ordering code table, 8X and 8MA2 package drawings, and update the disclaimer page. Correct pinouts from bottom to top view and reorganization figures. No changes to functional specification.

Atmel Document 8870 Revision C (July 2013)

Update status from preliminary to complete release and footers and the disclaimer page.

Atmel Document 8870 Revision B (September 2012)

Update ordering information.

Atmel Document 8870 Revision A (June 2012)

Initial release of this document.