11 Revision History
Revision D (November 2023)
Removed 8-pad XDFN product offering.
Revision C (December 2020)
Updated UDFN package drawing. Removed 4-ball and 6-ball WLCSP product offerings. Corrected Atmel document number in Revision History. Replaced terminology "Master" and "Slave" with "Host" and "Client" respectively.
Revision B (November 2018)
Corrected tPOFF typo from 1 ms to 500 ms. Updated the "Bus Timing" figure. Updated the section content throughout for clarification. Replaced the 8U2-1 VFBGA Package Outline Drawing with the 8U3-1 VFBGA Package Outline Drawing. Updated the SOIC, TSSOP and UDFN package drawings to Microchip format. Corrected Revision A history to further document changes.
Revision A (February 2018)
Updated to the Microchip template. Microchip DS20005937 replaces Atmel document 8850. Corrected tLOW typo from 400ns to 500ns. Corrected tAA typo from 550ns to 450ns. Updated Package Marking Information. Removed the 5‑ball WLCSP detail and ordering code. Updated Package Drawing 4U-12. Updated Product ID System. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Added a figure for “System Configuration Using 2‑Wire Serial EEPROMs”. Added POR recommendations section.
Atmel Document 8850 Revision D (May 2015)
Added the 4‑ball WLCSP, AT24C64D‑U2UM0B‑T option. Updated the 8S1 package drawing.
Atmel Document 8850 Revision C (February 2015)
Updated the 6‑ball and 5‑ball WLCSP package outline drawings to reflect offering of product with backside coating.
Atmel Document 8850 Revision B (December 2014)
Added the AT24C64D‑MAHM‑E product offering. Updated the 8X, 8MA2, 5U‑2, and 8U2‑1 package outline drawings and the ordering information.
Atmel Document 8850 Revision A (June 2013)
Initial document release.