43.3.6 Thermal Characteristics

Table 43-6.
Standard Operating Conditions (unless otherwise stated)
Param No.	Sym.	Characteristic	Typ.	Units	Conditions
TH01	θ_JA	Thermal Resistance Junction to Ambient	100	°C/W	14-pin PDIP package
			77.7	°C/W	14-pin SOIC package
			100	°C/W	14-pin TSSOP package
			30.9	°C/W	16-pin VQFN 4x4 mm package
			62.2	°C/W	20-pin PDIP package
			77.7	°C/W	20-pin SOIC package
			31.1	°C/W	20-pin SSOP package
			43.0	°C/W	20-pin VQFN 4x4 mm package
TH02⁽¹⁾	T_JMAX	Maximum Junction Temperature	150	°C
Note: See the "Absolute Maximum Ratings" section for total power dissipation.

DS40002339G

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