11 Revision History

Revision B (December 2020)

Updated Revision History to latest template. Removed thin height WLCSP product offering. Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively.

Revision A (May 2019)

Updated to Microchip template. Microchip DS20006197 replaces Atmel document 8812. Corrected t_LOW typo from 400 ns to 500 ns. Corrected t_AA typo from 550 ns to 450 ns. Updated Part Marking Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Updated SOIC package drawing to Microchip format.

Atmel Document 8828 Revision E (January 2017)

Updated Power-on Requirements and Reset Behavior section.

Atmel Document 8828 Revision D (May 2016)

Added the 8U-18 standard thickness WLCSP package option. Updated the “Clock and Data Transition Requirements” section and the “DC Characteristics” table.

Atmel Document 8828 Revision C (November 2015)

Corrected 8-ball WLCSP pinout.

Atmel Document 8828 Revision B (August 2015)

Updated the 8U-11 package drawing, data retention discrepancy and 8-ball pinout.

Atmel Document 8828 Revision A (May 2015)

Initial document release.