11 Revision History

Revision C (November 2024)

Corrected SOT23 package drawing reference in the Product Information System examples table to match the SOT23 NMB POD. No change to form, fit or function. Updated Date Codes table format.

Revision B (October 2023)

Removed 8-pad XDFN product offering. Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively.

Revision A (August 2018)

Updated to the Microchip template. Microchip DS20006051 replaces Atmel document 8719. Corrected tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns. Updated Part Marking Information. Updated the "Software Reset" section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Added a figure for “System Configuration Using 2‑Wire Serial EEPROMs”. Updated "Block Diagram" figure. Added POR recommendations section. Updated section content throughout for clarification. Updated the 5TS1 SOT23 and 8U3‑1 VFBGA package drawings. Updated the PDIP, SOIC, TSSOP and UDFN package drawings to Microchip format.

Atmel Document 8719 Revision D (December 2016)

Part marking SOT23:
  • Moved backside mark (YMXX) to front side line2
  • Added @ = Country of Assembly

Atmel Document 8719 Revision C (January 2015)

Added the UDFN Expanded Quantity Option. Updated the 8X, 8MA2, 8P3, and 8U3-1 package outline drawings, the ordering information section, and the disclaimer page.

Atmel Document 8719 Revision B (July 2013)

Minor grammatical corrections. Updated Atmel logos and template.

Atmel Document 8719 Revision A (September 2010)

Initial release of this document.