2 Pin Descriptions

The descriptions of the pins are listed in Table 2-1.

Table 2-1. Pin Function Table
Name8-Lead SOIC8-Lead TSSOP8-Pad UDFN(1)Function
A0(2)111Device Address Input
A1(2)222Device Address Input
A2(2)333Device Address Input
GND444Ground
SDA555Serial Data
SCL666Serial Clock
WP(2)777Write-Protect
VCC888Device Power Supply
Note:
  1. The exposed pad on this package can be connected to GND or left floating.
  2. If the A0, A1, A2 or WP pins are not driven, they are internally pulled down to GND. In order to operate in a wide variety of application environments, the pull‍-‍down mechanism is intentionally designed to be somewhat strong. Once this pin is biased above the CMOS input buffer’s trip point (~0.5 x VCC), the pull‌‍‑down mechanism disengages. Microchip recommends connecting this pin to a known state whenever possible.