11 Revision History

Revision C (February 2025)

Removed end-of-life grade 3 TSSOP CPNs. Updated DC Characteristics table to remove "Typical" column. Replaced terminology “Master” and “Slave” with “Host” and “Client”, respectively.

Revision B (June 2020)

Corrected Product Identification System. Updated UDFN package drawing.

Revision A (November 2019)

Updated to the Microchip template. Microchip DS20006270 replaces Atmel document 8818. Updated Part Marking Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Added a figure for “System Configuration Using Two‑Wire Serial EEPROMs”. Updated “Block Diagram” figure. Removed the Automotive Grade 2 option. Updated the SOIC, TSSOP and UDFN package drawings to Microchip format.

Atmel Document 8818 Revision C (July 2016)

Added the Automotive Grade 2 and 3 and UDFN options and table of contents. Updated the “Software Reset” section, part marking, 8S1 package drawing, disclaimer page, template and reorganize document.

Atmel Document 8818 Revision B (October 2012)

Removed preliminary status. Updated 8X — TSSOP package drawing. Updated Atmel logos and disclaimer/copy page.

Atmel Document 8818 Revision A (April 2012)

Initial document release.