1 Introduction

The device data sheet specifies a maximum operating junction temperature (TJ) (105°C for industrial devices, 125°C for automotive devices). This limit must be respected to ensure both correct operation and long lifetime(1) for the device. For this purpose, a thermal study should be included in the design process to verify the device operating temperature in the application and, if required, to take corrective action if this temperature is deemed too high.

Note:
  1. For detailed information, refer to the “SAMA7G5 Series Product Lifetime Estimation” application note. See Reference Documents.

This document is organized in the following way:

  • First, the basic thermal theory applying to semiconductor devices is reminded.
  • Then, the reader is provided with thermal measurements carried out on the SAMA7G54 evaluation kit and on SAMA7G5 Series SiP devices mounted on a similar board.
  • Finally, some software and hardware recommendations are provided to help system designers optimize applications from a thermal performance perspective.

In addition, Appendix A provides insights on Linux® operation with regards to these thermal aspects.