5 SAMA7G5 Series System-in-Package (SiP) Measurement Results

Integrating an SDRAM memory and an MPU in a System-in-Package (SiP) eliminates the high-speed memory interface constraints imposed on the PCB and reduces the PCB size. Junction temperature and power dissipation are also significant advantages. The larger package size of the SiP results in improved thermal performance compared to the SAMA7G5, improving the thermal resistance by about 30%. This leads to a lower operating junction temperature and hence a lower leakage power, and more generally a lower overall power consumption, particularly at high temperatures.

Use cases measurement conditions

Linux is started and reports a close to 100% CPU load for both of the following cases.

Case 1: Linux in idle mode, CPU frequency = 90 MHz, Linux governor in Power Save mode

Case 2: Linux in IPerf mode, CPU frequency = 1 Ghz, Linux governor in Performance mode