Features

  • CPU running up to 600 MHz
    • ARM926EJ-S Arm Thumb® processor
    • 32-Kbyte data cache, 32-Kbyte instruction cache, Memory Management Unit (MMU)
  • Memories
    • One 160-Kbyte internal ROM
      • 64-Kbyte internal ROM embedding a secure bootloader program supporting boot on NAND Flash, SD Card, SPI or QSPI Flash. Bootloader features selectable by OTP bits
      • 96-Kbyte ROM for NAND Flash BCH ECC table
    • One 64-Kbyte internal SRAM (SRAM0), single-cycle access at system speed
    • High-bandwidth Multi-port DDR2/LPDDR Controller
    • 32/16-bit External Bus Interface (EBI) supporting 8/4-bank DDR2/LPDDR, 4/2-bank SDR/LPSDR, static memories, with scrambling
    • NAND Flash Controller, with up to 24-bit Programmable Multi-bit Error Correcting Code
    • One 11-Kbyte OTP memory for secure key storage with emulation mode (OTP bits are emulated by a 4-Kbyte SRAM (SRAM1))
  • System Running up to 200 MHz
    • Power-on reset cells, Reset Controller, Shutdown Controller, Periodic Interval Timer, Watchdog Timer running on internal slow RC oscillator (32 kHz typical) and Real Time Clock running on slow crystal oscillator (32.768 kHz)
    • Two internal trimmed RC oscillators with typical values: 32 kHz (slow) and 12 MHz (fast)
    • Two crystal oscillators: 32.768 kHz (slow) and 12 to 48 MHz (fast)
    • One PLL for the system and one PLL optimized for USB high-speed operation (480 MHz)
    • One dual-port 16-channel DMA Controller
    • Advanced Interrupt Controller and Debug Unit
    • JTAG port with disable bit in OTP memory
    • Two programmable clock output signals
  • Low-Power Modes
    • Backup mode with RTC, eight 32-bit general purpose backup registers, and Shutdown Controller to control the external power supply
    • Clock Generator and Power Management Controller
    • Software-programmable ultra-low power modes: Very Slow Clock operating mode (ULP0), and No-Clock operating Mode (ULP1) with fast wake-up capabilities
    • Software programmable power optimization capabilities
  • Peripherals
    • LCD Controller with overlay, alpha-blending, rotation, scaling and color conversion. Up to 1024 x 768 resolution
    • 2D Graphics Controller supporting fill BLT, copy BLT, transparent BLT, blend/alpha BLT, ROP4 BLT (Raster Operations) and command ring buffer
    • ITU-R BT. 601/656, up to 12-bit Image Sensor Interface
    • One USB Device High Speed, three USB Host High Speed with dedicated On-Chip Transceivers
    • Two 10/100 Mbps Ethernet Mac Controller
    • Two 4-bit Secure Digital MultiMedia Card Controller
    • Two CAN Controllers
    • One Quad I/O SPI Controller
    • Two three-channel 32-bit Timers/Counters
    • One high resolution (64-bit) Periodic Interval Timer
    • One Synchronous Serial Controller
    • One Inter-IC Sound Multi-Channel Controller with TDM support
    • One Audio Class D Controller with single-ended or bridge-tied load connection to power stage
    • One four-channel 16-bit PWM Controller
    • Thirteen FLEXCOMs (USART, SPI and TWI)
    • One 12-channel 12-bit Analog-to-Digital Converter with 4/5 wires resistive touchscreen support
  • Hardware Cryptography
    • SHA (SHA1, SHA224, SHA256, SHA384, SHA512) and HMAC: compliant with FIPS PUB 180-2
    • AES: 256-, 192-, 128-bit key algorithms, compliant with FIPS PUB 197
    • TDES: two-key or three-key algorithms, compliant with FIPS PUB 46-3
    • True Random Number Generator, compliant with NIST Special Publication 800-22 Test Suite and FIPS PUBs 140-2 and 140-3
  • I/O Ports
    • Four 32-bit Parallel Input/Output Controllers
    • Up to 112 programmable I/O lines multiplexed with up to three peripheral I/Os
    • Input change interrupt capability on each I/O line, optional Schmitt trigger input
    • Individually programmable open-drain, pull-up and pull-down resistor, synchronous output
    • General-purpose analog and digital inputs tolerant to positive and negative current injection
  • Automotive
    • Qualification AEC-Q100 grade 2 ([-40°C to +105°C] ambient temperature)
  • Package
    • 228-ball TFBGA 11x11 mm², 0.65 mm pitch, optimized for standard class PCB layout (down to four layers)
  • Design for low ElectroMagnetic Interference (EMI)
    • Slewrate-controlled I/Os
    • DDR/SDR Phy with impedance-calibrated drivers
    • Spread spectrum PLLs
    • Careful BGA power/ground ball assignment to provide optimum decoupling capacitors placement
  • Operating Conditions
    • Ambient temperature range (TA): -40°C to +105°C
    • Junction temperature range (TJ): -40°C to +125°C