32-Kbyte data cache, 32-Kbyte
instruction cache, Memory Management Unit (MMU)
Memories
One 160-Kbyte internal ROM
64-Kbyte internal ROM
embedding a secure bootloader program supporting boot on NAND Flash,
SD Card, SPI or QSPI Flash. Bootloader features selectable by OTP bits
96-Kbyte ROM for NAND Flash
BCH ECC table
One 64-Kbyte internal SRAM
(SRAM0), single-cycle access at system speed
High-bandwidth Multi-port
DDR2/LPDDR Controller
32/16-bit External Bus Interface
(EBI) supporting 8/4-bank DDR2/LPDDR, 4/2-bank SDR/LPSDR, static memories, with
scrambling
NAND Flash Controller, with up to
24-bit Programmable Multi-bit Error Correcting Code
One 11-Kbyte OTP memory for secure
key storage with emulation mode (OTP bits are emulated by a 4-Kbyte SRAM
(SRAM1))
System Running up to 200 MHz
Power-on reset cells, Reset
Controller, Shutdown Controller, Periodic Interval Timer, Watchdog Timer running
on internal slow RC oscillator (32 kHz typical) and Real Time Clock running on
slow crystal oscillator (32.768 kHz)
Two internal trimmed RC
oscillators with typical values: 32 kHz (slow) and 12 MHz (fast)
Two crystal oscillators: 32.768
kHz (slow) and 12 to 48 MHz (fast)
One PLL for the system and one PLL
optimized for USB high-speed operation (480 MHz)
One dual-port 16-channel DMA
Controller
Advanced Interrupt Controller and
Debug Unit
JTAG port with disable bit in OTP
memory
Two programmable clock output
signals
Low-Power Modes
Backup mode with RTC, eight 32-bit
general purpose backup registers, and Shutdown Controller to control the external
power supply
Clock Generator and Power
Management Controller
Software-programmable ultra-low
power modes: Very Slow Clock operating mode (ULP0), and No-Clock operating Mode
(ULP1) with fast wake-up capabilities
Software programmable power
optimization capabilities
Peripherals
LCD Controller with overlay,
alpha-blending, rotation, scaling and color conversion. Up to 1024 x 768
resolution
2D Graphics Controller supporting fill BLT, copy BLT,
transparent BLT, blend/alpha BLT, ROP4 BLT (Raster Operations) and command ring
buffer
ITU-R BT. 601/656, up to 12-bit Image Sensor Interface
One USB Device High Speed, three USB Host High Speed with
dedicated On-Chip Transceivers
Two 10/100 Mbps Ethernet Mac Controller
Two 4-bit Secure Digital MultiMedia Card Controller
Two CAN Controllers
One Quad I/O SPI Controller
Two three-channel 32-bit Timers/Counters
One high resolution (64-bit) Periodic Interval Timer
One Synchronous Serial Controller
One Inter-IC Sound Multi-Channel Controller with TDM
support
One Audio Class D Controller with single-ended or bridge-tied
load connection to power stage
One four-channel 16-bit PWM Controller
Thirteen FLEXCOMs (USART, SPI and TWI)
One 12-channel 12-bit Analog-to-Digital Converter with 4/5 wires
resistive touchscreen support
Hardware Cryptography
SHA (SHA1, SHA224, SHA256, SHA384, SHA512) and HMAC: compliant
with FIPS PUB 180-2
AES: 256-, 192-, 128-bit key algorithms, compliant with FIPS PUB
197
TDES: two-key or three-key algorithms, compliant with FIPS PUB
46-3
True Random Number Generator, compliant with NIST Special
Publication 800-22 Test Suite and FIPS PUBs 140-2 and 140-3
I/O Ports
Four 32-bit Parallel Input/Output Controllers
Up to 112 programmable I/O lines multiplexed with up to three
peripheral I/Os
Input change interrupt capability on each I/O line, optional
Schmitt trigger input
Individually programmable open-drain, pull-up and pull-down
resistor, synchronous output
General-purpose analog and digital inputs tolerant to positive
and negative current injection
Automotive
Qualification AEC-Q100 grade 2 ([-40°C to +105°C] ambient
temperature)
Package
228-ball TFBGA 11x11 mm², 0.65 mm pitch, optimized for standard
class PCB layout (down to four layers)
Design for low ElectroMagnetic
Interference (EMI)
Slewrate-controlled I/Os
DDR/SDR Phy with
impedance-calibrated drivers
Spread spectrum PLLs
Careful BGA power/ground ball
assignment to provide optimum decoupling capacitors placement
Operating Conditions
Ambient temperature range (TA):
-40°C to +105°C
Junction temperature range (TJ):
-40°C to +125°C
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.