10.2.1 240-Ball TFBGA Mechanical Characteristics
Moisture Sensitivity Level | 3 |
250 | mg |
J-STD-609 Classification | e8 |
Ball Land | 0.45 mm |
Nominal Ball Diameter | 0.35 mm |
Solder Mask Opening | 0.250 mm |
Solder Mask Definition | SMD |
Solder | LF35 |
Moisture Sensitivity Level | 3 |
250 | mg |
J-STD-609 Classification | e8 |
Ball Land | 0.45 mm |
Nominal Ball Diameter | 0.35 mm |
Solder Mask Opening | 0.250 mm |
Solder Mask Definition | SMD |
Solder | LF35 |
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