6.1 Package Marking Information

32-Lead (8 x 20 mm package) Plastic Thin Small Outline Package, Type I (TSOP)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.