3.2.1 Xplained Pro Extension Headers

The headers (EXT1 and EXT3) on the WLR089 Xplained Pro Evaluation board offer access to the I/O of the module in order to expand the board by connecting extensions to the board. These headers are based on the standard extension header specified in Xplained Pro Standard Extension Header. The headers have a pitch of 2.54 mm.

Table 3-1. EXT1 Extension Header
EXT1Pins on WLR089U0 ModuleShared Functionality
PinSignal
1ID——
2GNDGND—
3ADC(+)PA06QTouch Button
4ADC(-)PA07Target USB
5GPIO1PA08EDBG, EXT3
6GPIO2PA28Mechanical Button
7PWM(+)PA18LED1
8PWM(-)PA19LED0
9IRQPA22(1)EDBG, Serial Flash
10SPI_SSPA15Target USB, EDBG, optional 12 MHz external crystal
11TWI_SDAPA16EXT3, EDBG
12TWI_SCLPA17EXT3, EDBG
13UART_RXPA05EDBG
14UART_TXPA04EDBG
15SPI_SSPA23—
16SPI_MOSIPB22EXT3, EDBG, Serial Flash
17SPI_MISOPB02EXT3, EDBG, Serial Flash
18SPI_SCKPB23EXT3, EDBG, Serial Flash
19GNDGND—
20VCC—Supply to peripherals
Note:
  1. Disconnect the jumper cap on J306 to use the IRQ line at pin 9 in the EXT1 header.
Table 3-2. EXT3 Extension Header
EXT3Pins on WLR089U0 ModuleShared Functionality
PinSignal
1ID——
2GNDGND—
3ADC(+)——
4ADC(-)——
5GPIO1PA27EDBG
6GPIO2——
7PWM(+)——
8PWM(-)——
9IRQ——
10SPI_SSPA08EXT1, EDBG
11TWI_SDAPA16EXT1, EDBG
12TWI_SCLPA17EXT1, EDBG
13UART_RX——
14UART_TX——
15SPI_SSPA14EDBG, optional 12 MHz external crystal
16SPI_MOSIPB22EXT1, EDBG, Serial Flash
17SPI_MISOPB02EXT1, EDBG, Serial Flash
18SPI_SCKPB23EXT1, EDBG, Serial Flash
19GNDGND—
20VCC—Supply to peripherals