The following figure illustrates the PCB layout recommended for a ZigBit module. Neither
via-holes nor wires are allowed on the PCB upper layer in the area occupied by the
module. As a critical requirement, ground the RF_GND pins via several via-holes to be
located right next to the pins, thus, minimizing inductance and preventing both mismatch
and losses.Figure 3-2. ATZB-RF-233-1-C Dimensions
Figure 3-3. ATZB-RF-233-1-C Pin Out
Figure 3-4. ATZB-RF-233-1-C Foot Print Dimensions
Figure 3-5. ATZB-RF-233-1-C Mounting Information
The ZigBit module’s location and orientation on the carrier board is illustrated in the preceding
figure. The recommended placement of the ZigBit module on the carrier board needs to be
accurately followed to ensure performance on the end application.
Note: The areas in the preceding figure for copper and component
keepout ensure superior performance of the ZigBit module on the end application. The
copper keepout recommended in the drawing applies for all layers of the carrier
board.
The dimension A of the carrier board must be equal to or greater than 20 mm. Similarly, the
dimension B must be equal to or greater than 25 mm.
The online versions of the documents are provided as a courtesy. Verify all content and data in the device’s PDF documentation found on the device product page.
