32.3.6 Thermal Characteristics

Table 32-8. 
Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +125°C

Param No.Sym.CharacteristicTyp.UnitsConditions
TH01θJAThermal Resistance Junction to Ambient60°C/W28-pin SPDIP package
56.72°C/W28-pin SOIC package
57.3°C/W28-pin SSOP package
39.1°C/W28-pin VQFN package
TH03TJMAXMaximum Junction Temperature150°C
TH04PDPower Dissipation—WPD = PINTERNAL + PI/O
TH05PINTERNALInternal Power Dissipation—WPINTERNAL = IDD x VDD(1)
TH06PI/OI/O Power Dissipation—WPI/O = Σ(IOL*VOL)+Σ(IOH*(VDD-VOH))
TH07PDERDerated Power—WPDER = PDMAX (TJ-TA)/θJA(2)
Note:
  1. IDD is current to run the chip alone without driving any load on the output pins.
  2. TA = Ambient Temperature, TJ = Junction Temperature.